THSF-ID7-B

ADLINK Technology
976-THSF-ID7-B
THSF-ID7-B

Mfr.:

Description:
Heat Sinks High profile heatsink with fan for Express-ID7 with threaded standoffs

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
18 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
105,99 € 105,99 €
97,53 € 975,30 €
91,02 € 2.275,50 €
87,77 € 4.388,50 €
84,54 € 8.454,00 €
250 Quote

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Heat Sinks
RoHS:  
Heat Sinks
Brand: ADLINK Technology
Product Type: Heat Sinks
Factory Pack Quantity: 1
Subcategory: Heat Sinks
Type: High Profile Heatsink
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Attributes selected: 0

CAHTS:
8473309000
USHTS:
8473305100
JPHTS:
847330090
MXHTS:
8473300499
ECCN:
EAR99

Express-ID7 Module

ADLINK Technology Express-ID7 Module is powered by the Intel® Xeon® D-1700 processor and offers integrated high-speed Ethernet (up to 4x 10G). The ADLINK Technology Express-ID7 also features 16 PCIe Gen4 lanes for immediate responsiveness. The device incorporates Intel® technologies like TCC, Deep Learning Boost (VNNI), and AVX-512 for accelerated AI performance. The Express-ID7 supports Time Sensitive Networking (TSN) for precisely controlling real-time workloads across networked devices. This rugged and edge AI-focused COM, featuring Intel® Ice Lake-D, empowers system integrators for diverse applications, including edge networking, robotics, autonomous driving, 5G, and more.