Aavid, Thermal Division of Boyd Corporation Zipper Fin Heat Sink Assemblies

Aavid Zipper Fin Heat Sink Assemblies are suitable for air-cooled solutions for high-powered forced convection applications for mass production. These heat sinks are optimized for Intel® Xenon® processor microarchitecture in an FCLGA3647 package. The zipper fin stack is constructed from a series of individual sheet metal fins that are folded, stamped, and zipped together without using interlocking features. The thin fin geometry lowers pressure drops, improves system airflow, and reduces fan costs. Because the zipper fins are joined together on both the top and bottom of the fins, these heat sink assemblies offer high mechanical stability. Aavid Zipper Fin Heat Sink Assemblies are ideal for higher volume, high-performance applications.


  • Maximum performance utilizing high-density fin fabrication
  • Thin fin geometry lowers pressure drop, improves system airflow, and reduces fan cost
  • Specialized thermal grease formulated for high-performance, pre-applied to the base
  • Designed to meet all Intel standards and requirements
  • Pre-assembled with captive mounting hardware and ready for installation with an instruction label
  • Precise surface flatness and high-performance thermal grease ensure minimum interface resistance
Published: 2019-03-20 | Updated: 2023-03-23