Advanced Thermal Solutions maxiFLOW™ Heatsinks
Advanced Thermal Solutions (ATS) maxiFLOW™ Heatsinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heatsink designs. The maxiFLOW™ heatsinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heatsink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heatsink.
ATS maxiFLOW™ heat sinks are well suited to meet the thermal requirements of a broad range of electronics packages such as Ball Grid Array (BGA), Quad Flat Package (QFP), Lead Chip Carrier (LCC), Land Grid Array (LGA), Ceramic Leaded Chip Carrier (CLCC), Thin Small Outline Package (TSOP), Dual Inline Package (DIP), and Low Profile Quad Flat Packages (LQFPs).
Features
- Fabricated from anodized extruded aluminum for maximum thermal performance
- Low profile spread fin array
- High thermal performance through convection cooling
- Designed for standard height components from 3mm to 4.5mm
- Available with maxiGRIP heat sink attachment, thermal tape, or push pin attachments
Applications
- Low profile component cooling
- Compatible with a broad range of electronic packages such as Ball Grid Array (BGA), Quad Flat Package (QFP), Lead Chip Carrier (LCC), Land Grid Array (LGA), Ceramic Leaded Chip Carrier (CLCC), Thin Small Outline Package (TSOP), Dual Inline Package (DIP), and Low Profile Quad Flat Packages (LQFPs)
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