Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD®

Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD^® is formulated to address the demands of high power density designs found in hyperscale and cloud-scale data centers. Bergquist TGP 12000ULM features high thermal conductivity and ultra-low modulus thermal interface material (TIM). These design features make the TGP 12000ULM ideal for modern datacom applications. Among the highest performing TIMs available on the market, TGP 12000ULM combines high thermal conductivity of 12.0W/m-K with soft, conforming properties to ensure excellent wet out at the interface for optimized thermal transfer and low assembly stress. TGP 12000ULM is built on a silicone-based resin platform with unique filler technology to accommodate excellent heat dissipation while simultaneously reducing stress on small footprint, miniaturized components.